Electronic apparatus and method for manufacturing the same

ABSTRACT

According to one embodiment, an electronic apparatus includes a first substrate, a second substrate, and a connecting material. The second substrate includes a second basement and a second conductive layer. The second basement has a third surface opposed to the first conductive layer and a fourth surface and is spaced apart from the first conductive layer. The second substrate has a first hole penetrating the second basement. The first substrate has a second hole. A third opening of the second hole is smaller than a first opening of the first hole. A connecting material connects the first conductive layer and the second conductive layer via the first hole.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromJapanese Patent Application No. 2016-149610, filed Jul. 29, 2016, theentire contents of which are incorporated herein by reference.

FIELD

Embodiments described herein relate generally to an electric apparatusand method for manufacturing the same.

BACKGROUND

In an electronic apparatus, a demand for high efficiency and low cost ofwiring mounting has been further increased. For example, in a displaydevice which is an example of an electronic apparatus, varioustechniques have been studied for narrowing a frame of the displaydevice. For example, a technique that electrically connects a wiringportion having an in-hole connector provided inside a hole penetratingan inner surface and an outer surface of a first substrate formed of aresin and a wiring portion provided on an inner surface of a secondsubstrate formed of a resin by an inter-substrate connector is disclosed(for example, JP 2002-40465 A).

SUMMARY

The present disclosure relates generally to an electric apparatus andmethod for manufacturing the same. In an embodiment, an electronicapparatus is provided. The electronic apparatus includes a firstsubstrate including a first basement and a first conductive layer; asecond substrate including a second basement and a second conductivelayer; and a connecting material electrically connecting the firstconductive layer and the second conductive layer, wherein the firstbasement includes a first surface and a second surface opposite to thefirst surface, the first conductive layer is located over the firstsurface, the second basement includes a third surface, a fourth surfaceopposite to the third surface, and a first hole penetrating the secondbasement, the third surface is opposed to the first conductive layer andspaced apart from the first conductive layer, the second conductivelayer is located on the fourth surface, the first hole includes a firstopening formed on the fourth surface and a second opening formed on thethird surface, the connecting material contacts the first conductivelayer and the second conductive layer via the first hole, the firstbasement further includes a second hole that penetrates the firstbasement and connects to the first hole, and the second hole includes athird opening that is smaller than the first opening and is opposed tothe second opening and a fourth opening that is formed on the secondsurface. In another embodiment, a method for manufacturing an electronicapparatus is provided. The method includes preparing a first substrateincluding a first basement and a first conductive layer and a secondsubstrate including a second basement and a second conductive layer, thesecond basement being opposed to the first conductive layer and spacedapart from the first conductive layer; forming a first hole penetratingthe second basement, forming a second hole penetrating the firstbasement, and forming a connecting material electrically connectingbetween the first conductive layer and the second conductive layer inthe first hole by filling the first hole with a conductive material.Additional features and advantages are described herein, and will beapparent from the following Detailed Description and the figures.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view illustrating a configuration example of a displaydevice DSP of a first embodiment;

FIG. 2 is a plan view schematically illustrating a basic configurationand an equivalent circuit of the display panel PNL illustrated in FIG.1;

FIG. 3 is a cross-sectional view illustrating a structure of a displayarea DA of the display panel PNL illustrated in FIG. 1;

FIG. 4 is a plan view illustrating a configuration example of a sensorSS according to the first embodiment;

FIG. 5 is a cross-sectional view taken along line F5-F5 in FIG. 1;

FIG. 6 is an enlarged cross-sectional view of a fourth hole VDillustrated in FIG. 5;

FIG. 7 is a cross-sectional view illustrating a configuration example ofa second hole VB of the first embodiment;

FIG. 8 is a cross-sectional view illustrating another configurationexample of the second hole VB of the first embodiment;

FIG. 9 is a cross-sectional view illustrating another configurationexample of the second hole VB of the first embodiment;

FIG. 10 is a cross-sectional view illustrating another configurationexample of the second hole VB of the first embodiment;

FIG. 11 is a cross-sectional view illustrating another configurationexample of the second hole VB of the first embodiment;

FIG. 12 is a plan view illustrating a configuration example of a firstopening OP1 and a third opening OP3 of the first embodiment;

FIG. 13 is a plan view illustrating another configuration example of thefirst opening OP1 and the third opening OP3 of the first embodiment;

FIG. 14 is a cross-sectional view for describing a method formanufacturing a display device DSP of a first embodiment;

FIG. 15 is a cross-sectional view for describing the method formanufacturing a display device DSP subsequent to FIG. 14;

FIG. 16 is a cross-sectional view for describing the method formanufacturing a display device DSP subsequent to FIG. 15;

FIG. 17 is a cross-sectional view for describing the method formanufacturing a display device DSP subsequent to FIG. 16;

FIG. 18 is a cross-sectional view for describing the method formanufacturing a display device DSP subsequent to FIG. 17;

FIG. 19 is a cross-sectional view for describing the method formanufacturing a display device DSP subsequent to FIG. 18;

FIG. 20 is a cross-sectional view for describing the method formanufacturing a display device DSP subsequent to FIG. 19;

FIG. 21 is a cross-sectional view for describing the method formanufacturing a display device DSP subsequent to FIG. 20;

FIG. 22 is a cross-sectional view for describing the method formanufacturing a display device DSP subsequent to FIG. 21;

FIG. 23 is a cross-sectional view for describing the method formanufacturing a display device DSP subsequent to FIG. 22; and

FIG. 24 is a cross-sectional view illustrating a configuration exampleof a display device DSP of a second embodiment.

DETAILED DESCRIPTION

In general, according to one embodiment, an electronic apparatusincludes a first substrate, a second substrate, and a connectingmaterial. The first substrate includes a first basement and a firstconductive layer. The first substrate has a first main surface on whicha first conductive layer is provided and a second main surface. Thesecond substrate includes a second basement and a second conductivelayer. The second basement has a third main surface opposed to the firstconductive layer and a fourth main surface and is spaced apart from thefirst conductive layer. The second substrate has a first holepenetrating the second basement. The first substrate has a second holethat penetrates the first basement and connects to the first hole. Athird opening of the second hole is smaller than a first opening of thefirst hole. A connecting material is filled in the first hole andelectrically connects the first conductive layer and the secondconductive layer via the first hole.

In addition, according to one embodiment, a method for manufacturing anelectronic apparatus includes preparing a first substrate including afirst substrate and a first conductive layer and a second conductivelayer including a second substrate and a second conductive layer. Thesecond substrate is opposed to the first conductive layer and is spacedapart from the first conductive layer. The second substrate is providedwith a first through hole penetrating the second substrate. The firstsubstrate is provided with a second through hole penetrating the firstsubstrate. The first through hole is filled with a conductive material,such that the first through hole is provided with a connection memberthat electrically connects the first conductive layer and the secondconductive layer.

Embodiments will be described hereinafter with reference to theaccompanying drawings. Incidentally, the disclosure is merely anexample, and proper changes within the spirit of the invention, whichare easily conceivable by a skilled person, are included in the scope ofthe invention as a matter of course. In addition, in some cases, inorder to make the description clearer, the widths, thicknesses, shapes,and the like of the respective parts are schematically illustrated inthe drawings, compared to the actual modes. However, the schematicillustration is merely an example, and adds no restrictions to theinterpretation of the invention. Besides, in the specification anddrawings, the structural elements having functions, which are identicalor similar to the functions of the structural elements described inconnection with preceding drawings, are denoted by like referencenumerals, and an overlapping detailed description is omitted unlessotherwise necessary.

In each embodiment, a display device is disclosed as an example of anelectronic device. The display device can be used for various devicessuch as a smart phone, a tablet terminal, a mobile phone terminal, anotebook type personal computer, and a game machine. Main componentsdisclosed in each embodiment can be applied to a liquid crystal displaydevice, a self-luminous display device such as an organicelectroluminescence display device, an electronic paper type displaydevice having an electrophoretic element and the like, a display deviceto which micro electro mechanical systems (MEMS) is applied, or adisplay device to which electrochromism is applied, and the like.

Further, the electronic device is not limited to the display device, andmay be, for example, an external type touch panel substrate that isoverlaid and attached on the display device. The present invention canbe applied to various electronic devices including an inter-substrateconducting structure in which a first basement and a second basement aredisposed to be spaced apart from each other, the second basement has afirst hole, a first conductive layer located on the first basement and asecond conductive layer located on the second substrate are electricallyconnected to each other via the first hole.

First Embodiment

FIG. 1 is a plan view illustrating an example of a display device DSP ofa first embodiment. A first direction X, a second direction Y, and athird direction Z are orthogonal to each other, but may intersect witheach other at an angle other than 90 degrees. The first direction X andthe second direction Y correspond to a direction parallel to a mainsurface of a substrate configuring a display device DSP and the thirddirection Z corresponds to a thickness direction of the display deviceDSP. Here, as an example of the display device DSP, a liquid crystaldisplay device equipped with a sensor SS will be described.

The display device DSP includes a display panel PNL, an IC chip I1, awiring substrate SUB3 or the like. The display panel PNL is a liquidcrystal panel, and includes a first substrate SUB1, a second substrateSUB2, a seal SE, and a liquid crystal layer LC. The second substrateSUB2 is opposed to the first substrate SUB1 in the third direction Z.The seal SE corresponds to a portion indicated diagonally upward rightin FIG. 1 and adheres the first substrate SUB1 to the second substrateSUB2. The liquid crystal layer LC is disposed between the firstsubstrate SUB1 and the second substrate SUB2 at an inner side of theseal SE.

In the following description, a direction from the first substrate SUB1toward the second substrate SUB2 is referred to as an upward directionand a direction from the second substrate SUB2 toward the firstsubstrate SUB1 is referred to as a downward direction. In addition, whatis viewed from the second substrate SUB2 toward the first substrate SUB1is referred to as a plan view.

The display panel PNL includes a display area DA that displays an imageand a frame-like non-display area NDA surrounding the display area DA.The display area DA is an example of a first area and is located insidean area surrounded by the seal SE. The non-display area NDA is anexample of a second area and is adjacent to the display area DA. Theseal SE is located in the non-display area NDA.

The wiring substrate SUB3 is mounted on the first substrate SUB1. Thewiring substrate SUB3 is, for example, a flexible substrate havingflexibility. It should be noted that the flexible substrate applicablein the present embodiment may include a flexible portion formed of abendable material formed in at least a part thereof. In other words, thewiring substrate SUB3 may be a flexible substrate the whole of which isconfigured as a flexible portion, and may be a rigid flexible substrateincluding a rigid portion formed of hard materials such as glass epoxyand a flexible portion formed of bendable materials such as polyimide.

The IC chip I1 is mounted over the wiring substrate SUB3. The IC chip I1is not limited to the example illustrated in FIG. 1, but the IC chip I1may be mounted over the first substrate SUB1 extending outwardly of thesecond substrate SUB2, or may be mounted over an external circuit boardconnected to the wiring substrate SUB3. The IC chip I1 includes, forexample, a display driver DD that outputs a signal necessary fordisplaying an image. The display driver DD includes, for example, atleast one of a signal line drive circuit SD, a scanning line drivecircuit GD, and a common electrode drive circuit CD which will bedescribed below. In addition, in the example illustrated in FIG. 1, theIC chip I1 includes a detection circuit RC that serves as a touch panelcontroller or the like. The detection circuit RC may be built in anotherIC chip different from the IC chip I1.

The display panel PNL may be, for example, a transmissive type having atransmissive display function of selectively transmitting light from alower side of the first substrate SUB1 to display an image, or may be areflective type having a reflective display function of selectivelyreflecting light from an upper side of the second substrate SUB2 todisplay an image. Alternatively, the display panel PNL may be atransflective type having the transmissive display function and thereflective display function.

The sensor SS performs sensing for detecting a contact or approach of anobject to the display device DSP. The sensor SS is provided with aplurality of detection electrodes Rx (Rx1, Rx2, Rx3, Rx4, . . . ). Thedetection electrode Rx is provided on the second substrate SUB2. Eachdetection electrode Rx extends in the first direction X and is arrangedat intervals in the second direction Y. The detection electrode Rxincludes a detector RS and a connector CN. In addition, each detectionelectrode Rx has a terminal RT (RT1, RT2, RT3, RT4, . . . ).

The detector RS is located in the display area DA and extends in thefirst direction X. In the detection electrode Rx, the detector RS ismainly used for sensing. As an example, the detector RS can be formedinto a stripe shape by an aggregate of fine metal wires. In addition, inthe example illustrated in FIG. 1, one detection electrode Rx includestwo detectors RS, but three or more detectors RS may be provided, or onedetector RS may be provided.

The terminal RT is located on one end side of the non-display area NDAalong the first direction X and is connected to the detector RS. Theconnector CN is located on one end side and the other end side of thenon-display area NDA along the first direction X, and connects theplurality of detectors RS to each other, and at the same time, isconnected to the terminal RT. In FIG. 1, one end side corresponds to aleft side of the display area DA and the other end side corresponds to aright side of the display area DA. A part of the terminal RT is formedat a location overlaying the seal SE in planar view.

The first substrate SUB1 includes pads P (P1, P2, P3, P4, . . . ) andwiring lines W (W1, W2, W3, W4, . . . ). The pad P and the wiring line Ware located at one end side or the other end side of the non-displayarea NDA and overlay the seal SE in planar view. The pad P is formed ata location overlaying the terminal RT in planar view. The wiring line Wis connected to the pad P, extends along the second direction Y, and iselectrically connected to the detection circuit RC of the IC chip I1 viathe wiring substrate SUB3.

The contact hole V (V1, V2, V3, V4, . . . ) is formed at a locationwhere the terminal RT and the pad P are opposed to each other. Inaddition, the contact hole V may penetrate through the pad P,simultaneously with penetrating the second substrate SUB2 including theterminal RT and the seal SE. In the example illustrated in FIG. 1, thecontact hole V has a circular shape in planar view, but it is notlimited thereto, and may have other shapes such as an ellipse. Theterminal RT is formed slightly larger than the contact hole V. In theexample illustrated in FIG. 1, the terminal RT has a circular shape, butit is not limited thereto, and may have other shapes such as an octagon.

The contact hole V is provided with a connecting material C to bedescribed below, and the terminal RT of the detection electrode Rx andthe pad P are electrically connected to each other via the connectingmaterial C. The detection electrode Rx is an example of the secondconductive layer L2 provided on the second substrate SUB2 that is spacedapart from the first substrate SUB1, and the pad P and the wiring line Ware an example of the first conductive layer L1 provided on the firstsubstrate SUB1.

The detection electrode Rx connected to the pad P is electricallyconnected to the detection circuit RC via the wiring substrate SUB3connected to the first substrate SUB1. The detection circuit RC reads asensor signal output from the detection electrode Rx and detects thepresence or absence of the contact or approach of the object, thelocation coordinate of the object or the like.

In the example illustrated in FIG. 1, all of the terminal RT (RT1, RT3,. . . ), the pad P (P1, P3, . . . ), the wiring line W (W1, W3, . . . ),and the contact hole V (V1, V3, . . . ) of each of the odd-numbereddetection electrodes Rx (Rx1, Rx3, . . . ) are located on one end sideof the non-display area NDA. In contrast, all of the terminal RT (RT2,RT4, . . . ), the pad P (P2, P4, . . . ), the wiring line W (W2, W4, . .. ), and the contact hole V (V2, V4, . . . ) of each of theeven-numbered detection electrodes Rx (Rx2, Rx4, . . . ) are located onthe other end side opposite to the one end side of the non-display areaNDA. According to the layout, a width of the one end side and a width ofthe other end side in the non-display area NDA can be uniform, which issuitable for narrowing the frame.

As illustrated in FIG. 1, in the layout in which the pad P3 is closer tothe wiring substrate SUB3 than the pad P1, the wiring line W1 bypassesan inner side of the pad P3, that is, a side close to the display areaDA, and are disposed in parallel inside the wiring line W3 between thepad P3 and the wiring substrate SUB3. Likewise, the wiring line W2bypasses an inner side of the pad P4 and is disposed in parallel insidethe wiring line W4 between the pad P4 and the wiring substrate SUB3.

FIG. 2 is a plan view schematically illustrating a basic configurationand an equivalent circuit of the display panel PNL illustrated in FIG.1.

The display panel PNL includes a plurality of pixels PX in the displayarea DA. Here, a pixel indicates a minimum unit that can be individuallycontrolled according to a pixel signal, and exists in, for example, aregion including a switching element disposed at a location where ascanning line and a signal line to be described below intersect eachother. The pixels PX are arrayed in a matrix in the first direction Xand the second direction Y. In addition, the display panel PNL includesa plurality of scanning lines G (G1 to Gn), a plurality of signal linesS (S1 to Sm), a common electrode CE or the like in the display area DA.

Each scanning line G extends in the first direction X and is arranged inthe second direction Y. Each signal line S extends in the seconddirection Y and is arranged in the first direction X. It should be notedthat the scanning line G and the signal line S may not necessarilyextend linearly, and a part thereof may be bent. The common electrode CEis arranged over the pixels PX.

The scanning line the signal line S, and the common electrode CE areeach led out to the non-display area NDA. In the non-display area NDA,the scanning line G is connected to the scanning line drive circuit GD,the signal line S is connected to the signal line drive circuit SD, andthe common electrode CE is connected to the common electrode drivecircuit CD. The signal line drive circuit SD, the scanning line drivecircuit GD, and the common electrode drive circuit CD may be formed onthe first substrate SUB1, and a part or all of them are built in the ICchip I1 illustrated in FIG. 1.

Each pixel PX includes a switching element SW, a pixel electrode PE, acommon electrode CE, a liquid crystal layer LC or the like. Theswitching element SW is formed of, for example, a thin film transistor(TFT) and is electrically connected to the scanning line G and thesignal line S. More specifically, the switching element SW includes agate electrode WG, a source electrode WS, and a drain electrode WD. Thegate electrode WG is electrically connected to the scanning line G. Inthe example illustrated in FIG. 2, the electrode electrically connectedto the signal line S is the source electrode WS, and the electrodeelectrically connected to the pixel electrode PE is the drain electrodeWD.

The scanning line G is connected to the switching element SW in each ofthe pixels PX arranged in the first direction X. The signal line S isconnected to the switching element SW in each of the pixels PX arrangedin the second direction Y. Each of the pixel electrodes PE is opposed tothe common electrode CE and drives the liquid crystal layer LC by anelectric field generated between the pixel electrode PE and the commonelectrode CE. A storage capacitor CS is formed, for example, between thecommon electrode CE and the pixel electrode PE.

FIG. 3 is a cross-sectional view of the display device DSP taken alongthe first direction X in the display area DA. In the example illustratedin FIG. 3, the display panel PNL mainly has a configurationcorresponding to a display mode using a horizontal electric fieldsubstantially parallel to an X-Y plane. It should be noted that thedisplay panel PNL may have a configuration corresponding to a verticalelectric field perpendicular to the X-Y plane, an inclined electricfield to the X-Y plane, or a display mode that uses a combination of theelectric fields.

In the display mode using the horizontal electric field, for example, aconfiguration in which either the first substrate SUB1 or the secondsubstrate SUB2 is provided with both of the pixel electrode PE and thecommon electrode CE can be applied. In the display mode using thevertical electric field or the inclined electric field, for example, aconfiguration in which the first substrate SUB1 is provided with any oneof the pixel electrode PE and the common electrode CE and the secondsubstrate SUB2 is provided with the other of the pixel electrode PE andthe common electrode CE can be applied.

The first substrate SUB1 includes the first basement 10, the signal lineS, the common electrode CE, a metal layer M, the pixel electrode PE, afirst insulating layer 11, a second insulating layer 12, a thirdinsulating layer 13, a first alignment film AL1 or the like. The firstbasement 10 has a first main surface 10A that is opposed to the secondsubstrate SUB2 and a second main surface 10B opposite to the first mainsurface 10A. In FIG. 3, the switching elements, the scanning lines,various insulating layers interposed therebetween or the like areomitted.

The first insulating layer 11 is located on the first main surface 10Aof the first basement 10. The scanning line or a semiconductor layer ofa switching element that is not shown is located between the firstbasement 10 and the first insulating layer 11. The signal line S islocated over the first insulating layer 11. The second insulating layer12 is located over the signal line S and the first insulating layer 11.The common electrode CE is located over the second insulating layer 12.

The metal layer M comes into contact with the common electrode CEdirectly above the signal line S. In the example illustrated in FIG. 3,the metal layer M is located over the common electrode CE, but it may belocated between the common electrode CE and the second insulating layer12. The third insulating layer 13 is located over the common electrodeCE and the metal layer M. The pixel electrode PE is located over thethird insulating layer 13. The pixel electrode PE is opposed to thecommon electrode CE via the third insulating layer 13. In addition, thepixel electrode PE has a slit SL at a location where the pixel electrodePE is opposed to the common electrode CE. The first alignment film AL1covers the pixel electrode PE and the third insulating layer 13.

The scanning line the signal line S, and the metal layer M are formed ofmetal materials such as molybdenum, tungsten, titanium, and aluminum. Itshould be noted that the scanning line the signal line S, and the metallayer M may have a single layer structure or a multilayer structure. Thecommon electrode CE and the pixel electrode PE are formed of transparentconductive materials such as indium tin oxide (ITO) or indium zinc oxide(IZO). The first insulating layer 11 and the third insulating layer 13are inorganic insulating layers and the second insulating layer 12 is anorganic insulating layer.

It should be noted that the configuration of the first substrate SUB1 isnot limited to the example illustrated in FIG. 3, and the pixelelectrode PE may be located between the second insulating layer 12 andthe third insulating layer 13 and the common electrode CE may be locatedbetween the third insulating layer 13 and the first alignment film AL1.In such a case, the pixel electrode PE is formed in a flat plate shapewithout a slit, and the common electrode CE has a slit opposed to thepixel electrode PE. In addition, both the pixel electrode PE and thecommon electrode CE may be formed in a comb shape and may be disposed soas to be engaged with each other.

The second substrate SUB2 includes a second basement 20, alight-shielding layer BM, a color filter CF, an overcoat layer OC, asecond alignment film AL2 or the like. The second basement 20 has athird main surface 20A opposed to the first substrate SUB1 and a fourthmain surface 20B opposite to the third main surface 20A.

The light-shielding layer BM and the color filter CF are located overthe third main surface 20A of the second basement 20. Thelight-shielding layer BM partitions each pixel and is located directlyabove the signal line S. The color filter CF is opposed to the pixelelectrode PE, and a part thereof overlays the light-shielding layer BM.The color filter CF includes a red color filter, a green color filter, ablue color filter or the like. The overcoat layer OC covers the colorfilter CF. The second alignment film AL2 covers the overcoat layer OC.

It should be noted that the color filter CF may be disposed on the firstsubstrate SUB1. The color filter CF may include color filters for fouror more colors. A pixel displaying white may be provided with a whitecolor filter, provided with an uncolored resin material, or providedwith the overcoat layer OC without being provided with the color filter.

A first polarizer PL1 is located between the first basement 10 and anillumination device BL. A second polarizer PL2 is located over thedetection electrode Rx that is provided over the fourth main surface 20Bof the second basement 20. It should be noted that the first polarizerPL1 and the second polarizer PL2 may be additionally provided with aretardation film or the like, if necessary.

A configuration example of the sensor SS mounted over the display deviceDSP of the present embodiment will be described with reference to FIG.4. The sensor SS illustrated in FIG. 4 is, for example, amutual-capacitive electrostatic capacitance type, and can detect acontact or an approach of an object based on a change in electrostaticcapacitance between a pair of electrodes opposed to each other via adielectric. The sensor SS is, for example, an in-cell type touch panel.

The sensor SS includes a sensor driving electrode Tx and the detectionelectrode Rx. In the example illustrated in FIG. 4, the sensor drivingelectrode Tx corresponds to a portion indicated diagonally downwardright and is provided on the first substrate SUB1. In addition, thedetection electrode Rx corresponds to a portion indicated diagonallyupward right and is provided on the second substrate SUB2. The sensordriving electrode Tx and the detection electrode Rx intersect with eachother in the X-Y plane. The detection electrode Rx is opposed to thesensor driving electrode Tx in the third direction Z.

The sensor driving electrode Tx and the detection electrode Rx arelocated in the display area DA, and a part of the sensor drivingelectrode Tx and the detection electrode Rx extends to the non-displayarea NDA. In the example illustrated in FIG. 4, each of the sensordriving electrodes Tx has a stripe shape extending in the seconddirection Y, and the sensor driving electrodes Tx are arranged atintervals in the first direction X. Each of the detection electrodes Rxextends in the first direction X and the detection electrodes Rx arearranged at intervals in the second direction Y. The detection electrodeRx is electrically connected to the pad P by the inter-substrateconducting structure and is connected to the detection circuit RC viathe wiring line W.

Each of the sensor driving electrodes Tx is electrically connected tothe common electrode drive circuit CD via the wiring line W. It shouldbe noted that the number, size and shape of the sensor drivingelectrodes Tx and the detection electrodes Rx are not particularlylimited, and can be variously changed. The sensor driving electrode Txincludes the above-mentioned common electrode CE and serves to generatean electric field between the sensor driving electrode Tx and the pixelelectrode PE and generate capacitance between the sensor drivingelectrode Tx and the detection electrode Rx to detect a location of anobject.

The common electrode drive circuit CD supplies a common drive signal tothe sensor driving electrode Tx including the common electrode CE duringdisplay driving for displaying an image in the display area DA. Inaddition, the common electrode drive circuit CD supplies a sensor drivesignal to the sensor driving electrode Tx during sensing driving forsensing. As the sensor drive signal is supplied to the sensor drivingelectrode Tx, the detection electrode Rx outputs a sensor signalnecessary for sensing, in other words, a signal based on a change ininter-electrode capacitance between the sensor driving electrode Tx andthe detection electrode Rx. The detection signal output from thedetection electrode Rx is input to the detection circuit RC illustratedin FIG. 1.

It should be noted that the sensor SS is not limited to the mutualcapacitive type of detecting an object based on the electrostaticcapacitance between the pair of electrodes, that is, the change in theelectrostatic capacitance between the sensor driving electrode Tx andthe detection electrode Rx, and may be a self-capacitive type thatdetects an object based on a change in capacitance of the detectionelectrode Rx itself.

Next, the above-mentioned contact hole V (V1, V2, V3, V4, . . . ) willbe described. FIG. 5 is a schematic cross-sectional view of the displaydevice DSP taken along the line F5-F5 in FIG. 1.

In the example illustrated in FIG. 5, in the inter-substrate conductingstructure provided in the non-display area NDA, the display device DSPincludes the first substrate SUB1, the second substrate SUB2, an organicinsulating layer OI, a protective film PF, the connecting material C,the first polarizer PL1, and the second polarizer PL2. The firstpolarizer PL1 adheres to the first substrate SUB1 by an adhesive layerAD1. The second polarizer PL2 adheres to the second substrate SUB2 by anadhesive layer AD2.

The first substrate SUB1 includes the above-mentioned first basement 10and the first conductive layer L1. The first conductive layer L1includes the pad P (P1, P2, P3, P4, . . . ) or the wiring line W (W1,W2, W3, W4, . . . ) that are described above and is located over thefirst main surface 10A side opposed to the second substrate SUB2. Thefirst insulating layer 11 illustrated in FIG. 3, another insulatinglayer, or another conductive layer may be disposed between the firstbasement 10 and the pad P and between the first basement 10 and thesecond insulating layer 12.

The second substrate SUB2 includes the second basement 20 and the secondconductive layer L2 described above. The third main surface 20A of thesecond basement 20 is opposed to the first conductive layer L1 and isspaced apart from the first conductive layer L1 in the third directionZ. The second conductive layer L2 includes the above-mentioned detectionelectrode Rx, that is, the terminal RT (RT1, RT2, RT3, RT4, . . . ) orthe connector CN. The second conductive layer L2 is located over thefourth main surface 20B side and is covered with the protective film PF.In other words, the first basement 10, the first conductive layer L1,the second basement 20, the second conductive layer L2, and theprotective film PF are arranged in the third direction Z in this order.

The material of the first and second basements 10 and 20 is, forexample, glass, or more specifically, alkali-free glass. Note that thematerial may be a flexible resin such as polyimide.

The first and second basements 10 and 20 are substrates formed ofalkali-free glass, for example. The first and second conductive layersL1 and L2 are formed of metal materials such as molybdenum, tungsten,titanium, aluminum, silver, copper, and chromium, an alloy in whichthese metal materials are combined, or transparent conductive materialssuch as ITO or IZO. The first and second conductive layers L1 and L2 mayalso have a single layer structure or a multilayer structure.

The organic insulating layer OI is located between the first conductivelayer L1 and the second basement 20. Instead of the organic insulatinglayer OI, an inorganic insulating layer or another conductive layer maybe located, or an air layer may be located. It should be noted thatvarious insulating layers or various conductive layers may be disposedbetween the second basement 20 and the second conductive layer L2 orover the second conductive layer L2.

For example, the organic insulating layer OI includes the seal SE forbonding the first substrate SUB1 and the second substrate SUB2, thesecond insulating layer 12 of the first substrate SUB1, thelight-shielding layer BM and the overcoat layer OC of the secondsubstrate or the like. The seal SE is located between the secondinsulating layer 12 and the overcoat layer OC. The liquid crystal layerLC is located in a gap between the first substrate SUB1 and the secondsubstrate SUB2 and is surrounded by the seal SE.

It should be noted that the metal layer M, the third insulating layer13, and the first alignment film AL1 illustrated in FIG. 3 may beinterposed between the second insulating layer 12 and the seal SE. Thesecond alignment film AL2 illustrated in FIG. 3 may be interposedbetween the overcoat layer OC and the seal SE.

In the example illustrated in FIG. 5, the display device DSP includes afirst hole VA penetrating the second basement 20, a second hole VBpenetrating the first basement 10, a third hole VC penetrating the padP, a fourth hole VD penetrating various organic insulating layers OI,and a concavity CC formed over the first basement 10. The first hole VA,the third hole VC, the fourth hole VD, and the concavity CC connect toeach other to form the above-described contact hole V. The second holeVB allows the contact hole V to connect to the second main surface 10Bof the first basement 10.

The first hole VA penetrates the third main surface 20A and the fourthmain surface 20B of the second basement 20. In the example illustratedin FIG. 5, the first hole VA penetrates even the second conductive layerL2. The first hole VA allows a first opening OP1 to be formed over thefourth main surface 20B and a second opening OP2 to be formed on thethird main surface 20A. The third hole VC penetrates the firstconductive layer L1 at the pad P and is opposed to the first hole VA inthe third direction Z.

The concavity CC is formed from the first main surface 10A of the firstbasement 10 toward the second main surface 10B thereof and does notpenetrate up to the second main surface 10B thereof. The concavity CC isopposed to the third hole VC in the third direction Z. In one example,the depth of the concavity CC along the third direction Z is about ⅕ toabout ½ of a thickness of the first basement 10 in the third directionZ.

FIG. 6 is an enlarged cross-sectional view of the fourth hole VD. In theexample illustrated in FIG. 6, the fourth hole VD includes a firstportion VD1 penetrating the second insulating layer 12, a second portionVD2 penetrating the seal SE, and a third portion VD3 penetrating thelight-shielding layer BM and the overcoat layer OC.

In the example illustrated in FIG. 6, the fourth hole VD is extended inthe first direction X as compared with the first and third holes VA andVC. It should be noted that the fourth hole VD extends beyond the firstand third holes VA and VC over all directions on the X-Y plane as wellas in the first direction X. For this reason, the first conductive layerL1 has an upper surface LT1 that is not covered with the organicinsulating layer OI in the vicinity of the third hole VC.

Any of the third and fourth holes VC and VD and the concavity CC islocated directly under the first hole VA, and the first hole VA, thefourth hole VD, the third hole VC, and the concavity CC are arranged inthe third direction Z in order. The contact hole V can be formed byirradiating laser light or etching from above the second substrate SUB2.The various organic insulating layers OI on which the fourth hole VD isprovided are formed from, for example, materials having a melting pointlower than that of the second basement 20 on which the first hole VA isprovided and the first conductive layer L1 on which the third hole VC isprovided. Alternatively, various organic insulating layers OI are formedfrom materials that are easily etched.

As illustrated in FIG. 5, the connecting material C is disposed in thecontact hole V. The connecting material C electrically connects the padP and the detection electrode Rx via the contact hole V. In the exampleillustrated in FIG. 5, the connecting material C comes into contact withan upper surface LT2 of the second conductive layer L2 and an innersurface of the first hole VA, respectively, in the second substrateSUB2. It should be noted that the inner surface of the first hole VA isprovided with an inner surface LS2 of the second conductive layer L2 inthe first hole VA and an inner surface 20S of the second basement 20 inthe first hole VA. For example, it is preferable that the connectingmaterial C contains metal materials such as silver, and a particlediameter of the metal material includes fine particles of the order ofseveral nanometers to several tens of nanometers.

In addition, as illustrated in FIG. 6, the connecting material C comesinto contact with an inner surface of the fourth hole VD at a gapbetween the first substrate SUB1 and the second substrate SUB2. Itshould be noted that the inner surface of the fourth hole VD is providedwith an inner surface OIS of the organic insulating layer OI in thefourth hole VD. Since the fourth hole VD is extended in a radialdirection from the first and third holes VA and VC, the connectingmaterial C has an enlarged diameter portion CB that is expanded in aradial direction from an inner surface 20S of the first hole VA and aninner surface LS1 of the third hole VC at a gap between the firstsubstrate SUB1 and the second substrate SUB2.

In addition, the connecting material C comes into contact with the uppersurface LT1 of the first conductive layer L1, the inner surface of thethird hole VC, and the concavity CC, respectively, in the firstsubstrate SUB1. The inner surface of the third hole VC is provided withthe inner surface LS1 of the first conductive layer L1 in the third holeVC. The above-described enlarged diameter portion CB comes into contactwith the upper surface LT1 of the first conductive layer L1.

In the examples illustrated in FIGS. 5 and 6, the connecting material Cis provided over the inner surface (inner surface LS2, inner surface20S) of the first hole VA, the inner surface (inner surface OIS) of thefourth hole VD, the inner surface (inner surface LS1) of the third holeVC, and the concavity CC and provided in the vicinity thereof, but theconnecting material C is not filled in the vicinity of the centers ofthe first, third and fourth holes VA, VC, VD. For this reason, theconnecting material C has a hollow. The connecting material C having theshape is formed by injecting the connecting material C from the firsthole VA under a barometric pressure or under the environment ofatmospheric pressure lower than the barometric pressure and removing asolvent contained in the connecting material C.

As illustrated in FIG. 5, the second conductive layer L2 and theconnecting material C are covered with the protective film PF. Theprotective film PF also fills the hollow of the connecting material C.The protective film PF is formed of, for example, organic insulatingmaterials such as an acrylic resin. It should be noted that theconnecting material C may be formed not to have the hollow. An adhesivelayer AD2 is formed over the protective film PF and a second polarizerPL2 is attached to the protective film PF via the adhesive layer AD2.

The connecting material C is continuously formed between the firstconductive layer L1 and the second conductive layer L2 without beinginterrupted. By doing so, the second conductive layer L2 is electricallyconnected to the above-described wiring substrate SUB3 via theconnecting material C and the first conductive layer L1. For thisreason, a control circuit that writes a signal into the secondconductive layer L2 or reads a signal output from the second conductivelayer L2 can be connected to the second conductive layer L2 via thewiring substrate SUB3. Therefore, in order to connect the secondconductive layer L2 and the control circuit, there is no need toseparately provide a wiring substrate for the second substrate SUB2.

Next, the second hole VB will be described in detail.

The second hole VB penetrates the first basement 10 from a third openingOP3 opened to a bottom of the contact hole V to a fourth opening OP4opened to the second main surface 10B. In the example illustrated inFIG. 5, the third opening OP3 that is an upper end of the second hole VBis formed in the concavity CC. The third opening OP3 that is an upperend of the second hole VB is opposed to the second opening OP2 that is alower end of the first hole VA.

The adhesive layer AD1 is formed over the second main surface 10B and isattached to the first polarizer PL1 via the adhesive layer AD1. Thefourth opening OP4 that is a lower end of the second hole VB is closedby the first polarizer PL1 or the adhesive layer AD1. As the exampleillustrated in FIG. 5, the fourth opening OP4 may be closed by the sealSE2.

FIG. 7 is a cross-sectional view illustrating one configuration exampleof the second hole VB. In the example illustrated in FIG. 7, the firsthole VA is formed to be tapered from the fourth main surface 20B of thesecond basement 20 toward the third main surface 20A thereof. That is, awidth (inner diameter) of the first hole VA is reduced from the fourthmain surface 20B toward the third main surface 20A. Similarly, thesecond hole VB is formed to be tapered from the first main surface 10Aof the first basement 10 toward the second main surface 10B thereof.That is, a width (inner diameter) of the second hole VB is reduced fromthe first main surface 10A toward the second main surface 10B.

Comparing the first hole VA with the second hole VB, a gradient T2formed between the central axis of the second hole VB and the innersurface 10S of the second hole VB is smaller than a gradient T1 formedbetween the central axis of the first hole VA and the inner surface 20Sof the first hole VA. With such a shape, it is possible to suppress theconnecting material C filled from the first hole VA from spreading tothe second hole VB due to a capillary phenomenon and prevent theconnecting material C from leaking through the second hole VB.

In the example illustrated in FIG. 7, an axial direction of the firsthole VA coincides with a normal direction of the third main surface 20Aof the second basement 20 and an axial direction of the second hole VBcoincides with the second main surface 10B of the first basement 10. Forthis reason, in the example illustrated in FIG. 7, it can be said thatthe gradient T2 is an inclination angle of the inner surface 20S of thefirst hole VA with respect to a normal line of the third main surface20A. It can be said that the gradient T1 is, for example, an inclinationangle of the inner surface 10S of the second hole VB with respect to thenormal line direction of the second main surface 10B.

As illustrated in FIG. 7, a protruding portion CA filled with a part ofthe connecting material C may be formed at the upper end of the secondhole VB. In this case, the connecting material C stops in the middle ofthe second hole VB, and thus is filled not to reach the fourth openingOP4 of the second main surface 10B.

FIG. 8 is a cross-sectional view illustrating another configurationexample of the second hole VB. The second hole VB illustrated in FIG. 8is different from the example illustrated in FIG. 7 in that it is formedto be thickened from the first main surface 10A toward the second mainsurface 10B. That is, a width (inner diameter) of the second hole VB isincreased from the first main surface 10A toward the second main surface10B. With such a shape, it is possible to increase the resistance whenthe connecting material C passes through the second hole VB by thecapillary phenomenon to prevent the connecting material C from leakingthrough the second hole VB. Similarly to FIG. 7, the connecting materialC has the protruding portion CA that protrudes from the contact hole Vand is located in the second hole VB.

FIG. 9 is a cross-sectional view illustrating another configurationexample of the second hole VB. The central axis of the second hole VBindicated by a one dot chain line in FIG. 9 is inclined in a directionperpendicular to the first main surface 10A, that is, in the thirddirection Z. With such a shape, comparing with the case where thecentral axis is parallel to the third direction Z, the second hole VBbecomes long. Accordingly, the connecting material C does not easilyreach the fourth opening OP4 of the second hole VB, and it is possibleto prevent the connecting material C from leaking through the secondhole VB.

For example, when a plurality of contact holes V are disposed to beadjacent to each other, if the inclinations of the second holes VB arealigned in the same direction, the second holes VB communicating witheach of the contact holes V can be disposed not to interfere with eachother. Alternatively, if the fourth opening OP4 is disposed to beincluded in the first opening OP1 when viewed in planar view, the secondholes VB communicating with each of the contact holes V can be disposednot to interfere with each other without relying on the inclineddirection of the second hole VB.

FIG. 10 is a cross-sectional view illustrating another configurationexample of the second hole VB. The second hole VB illustrated in FIG. 10has a bent portion VBC and is bent on the way to the second main surface10B. For example, the second hole VB having the shape can be formed byirradiating laser light that causes cracks only in the focused insidewithout damaging the surface. Alternatively, after a bottomed holeextending in the second direction Y is formed by irradiating laser lightfrom the side surface of the first basement 10, the second hole VB canbe formed by irradiating with laser light in the third direction Z. Evenin the shape of the second hole VB illustrated in FIG. 10, the secondhole VB becomes long and the resistance of the connecting material Cpassing through the second hole VB increases such that it is possible toprevent the connecting material C from leaking through the second holeVB.

FIG. 11 is a cross-sectional view illustrating another configurationexample of the second hole VB. The second hole VB illustrated in FIG. 11is branched on the way and bent. That is, the second hole VB has twobent portions VBC and two fourth openings OP4. Even in the shape of thesecond hole VB illustrated in FIG. 11, the second hole VB becomes longand the resistance of the connecting material C passing through thesecond hole VB increases, such that it is possible to prevent theconnecting material C from leaking through the second hole VB.

In FIGS. 10 and 11, the second hole VB is vertically bent at the bentportion VBC, but the second hole VB may also be smoothly bent at thebent portion VBC. In addition, FIGS. 5 to 11 illustrate an example inwhich one second hole VB is provided for one contact hole V, but theplurality of second holes VB may be provided for one contact hole V.

FIG. 12 is a plan view of a configuration example of the second hole VB,and FIG. 13 is a plan view of another configuration example of thesecond hole VB. As illustrated in FIG. 12, the third opening OP3 isformed to be smaller than the first opening OP1 of the first hole VA andis opposed to the first hole VA in the third direction Z. A diameter D2of the third opening OP3 at the upper end of the second hole VB is, forexample, ⅕ or less of a diameter D1 of the first opening OP1 at theupper end of the first hole VA. The diameter D2 of the third opening OP3is, for example, 5 μm or more or 30 μm or less.

In this case, when the first and third openings OP1 and OP3 are aregular circle, the diameters D1 and D2 of the first and third openingsOP1 and OP3 are, for example, the same diameter, and when the first andthird openings OP1 and OP3 are ellipses, the diameters D1 and D2 of thefirst and third openings OP1 and OP3 are, for example, a long diameter.As the example illustrated in FIG. 13, when the first and third openingsOP1 and OP3 are a distorted circle, the diameters D1, D2 may be amaximum diameter. Alternatively, an area of the third opening OP3 maybe, for example, 1/25 or less of an area of the first opening OP1 whenviewed in planar view.

According to the configuration in which the first opening OP1 and thethird opening OP3 have the size relationship, a diameter of a droplet ofthe connecting material C injected from the first opening OP1 into thefirst hole VA becomes larger than that of the third opening OP3 of thesecond hole VB, thereby preventing the connecting material C fromleaking from the third opening OP3.

Next, an example of a method for manufacturing a display device DSP willbe described with reference to FIGS. 14 to 23.

First, as illustrated in FIG. 14, a display panel PNL is prepared. Thedisplay panel PNL illustrated in FIG. 14 includes the first substrateSUB1 including at least the first basement 10 and the first conductivelayer L1 and the second substrate SUB2 including at least the secondbasement 20 and the second conductive layer L2. In the display panelPNL, the first substrate SUB1 and the second substrate SUB2 adhere toeach other by the seal SE in the state where the second basement 20 isopposed to the first conductive layer L1 and the second basement 20 isspaced apart from the first conductive layer L1. The second conductivelayer L2 is provided with the second hole VB in advance and the surfacethereof is covered with the protective film PF.

Describing an example of the method for manufacturing a display panelPNL, the first substrate SUB1 having the first conductive layer L1 orthe second insulating layer 12 or the like formed over the first mainsurface 10A of the first basement 10 is prepared. The second substrateSUB2 having the light-shielding layer BM, the overcoat layer OC or thelike formed over the third main surface 20A of the second basement 20 isprepared.

At this point, the second conductive layer L2 is not formed over thefourth main surface 20B of the second substrate SUB2. A loop-shaped sealSE is formed on any one of the first substrate SUB1 and the secondsubstrate SUB2, and a liquid crystal material drops into the seal SE.Thereafter, the first substrate SUB1 and the second substrate SUB2 arebonded to each other, and the seal SE is cured so that the firstsubstrate SUB1 adheres to the second substrate SUB2.

Thereafter, the first basement 10 and the second basement 20 are eachetched with an etchant such as hydrofluoric acid (HF) to make the firstbasement 10 and the second basement 20 thin. Thereafter, the secondconductive layer L2 is formed over the fourth main surface 20B of thesecond basement 20. At this point, the second hole VB can be patternedat the same time. Note that the second conductive layer L2 may be formedfirst, and then the second hole VB may be formed. By doing so, thedisplay panel PNL illustrated in FIG. 14 is manufactured.

Another example of the method for manufacturing a display panel PNL willbe described. That is, similarly to the above example, while the firstsubstrate SUB1 is prepared, the light-shielding layer BM, the overcoatlayer OC or the like are formed over the third main surface 20A of thesecond basement 20 and the second substrate SUB2 on which the secondconductive layer L2 having the second hole VB patterned over the fourthmain surface 20B of the second basement 20 is formed is prepared.Thereafter, the seal SE is formed, the liquid crystal material drops,and then the first substrate SUB1 and the second substrate SUB2 adhereto each other. By doing so, the display panel PNL illustrated in FIG. 14is manufactured.

Subsequently, as illustrated in FIG. 15, the second substrate SUB2 isirradiated with first laser light LSR1. In the example illustrated inFIG. 15, the first laser light LSR1 is irradiated from above the secondconductive layer L2. As a laser light source, for example, a carbondioxide gas laser device or the like can be applied, but any device thatcan perform a drilling process on a glass material and an organicmaterial can be used, and an excimer laser device or the like can alsobe applied.

As illustrated in FIG. 16, the first hole VA penetrating the secondbasement 20 and the second conductive layer L2 is formed by irradiatingthe first laser light LSR1. In addition, in the example illustrated inFIG. 16, when the first laser light LSR1 is irradiated, the thirdportion VD3 of the fourth hole VD penetrating the light-shielding layerBM and the overcoat layer OC, the second portion VD2 penetrating theseal SE, the first portion VD1 penetrating the second insulating layer12, the third hole VC penetrating the first conductive layer L1, and theconcavity CC of the first basement 10 are formed at the same time. Bydoing so, the contact hole V for connecting the first conductive layerL1 and the second conductive layer L2 is formed.

Furthermore, as illustrated in FIG. 17, the first basement 10 isirradiated with second laser light LSR2 via the contact hole V. Thesecond laser light LSR2 has a smaller diameter than the first laserlight LSR1. For example, if an optical axis of the first laser lightLSR1 coincides with that of the second laser light LSR2, the laser lightcan be applied continuously without moving the laser light source. Asillustrated in FIG. 18, the second hole VB penetrating the firstbasement 10 is formed on the bottom of the contact hole V by the secondlaser light LSR2.

Subsequently, the connecting material C for electrically connecting thefirst conductive layer L1 and the second conductive layer L2 is formed.First, as illustrated in FIG. 19, the connecting material C is injectedinto the first hole VA. An injection device may be an ink jet or adispenser. An example of the diameter of the droplet of the connectingmaterial C injected by these devices is about ⅕ of the diameter of thefirst opening OP1.

An internal space SP in which gases such as air remain is formed betweenthe connecting material C and the first conductive layer L1 by theinjected connecting material C. However, as illustrated in FIG. 20, ifthe gases remaining in the internal space SP are released from thesecond hole VB, the connecting material C flows from the first hole VAinto the third and fourth holes VC and VD and the concavity CC.

At this point, the gas may be expelled from the second hole VB by aweight of the connecting material C. Inert gas such as nitrogen gas orargon may be blown from the second substrate SUB2 side to push theconnecting material C into the contact hole V and the gas may also beexpelled from the second hole VB. Alternatively, gas may be sucked fromthe second main surface 10B side and sucked out from the second hole VB.If the gases remaining in the internal space SP are degassed through thesecond hole VB, the connecting material C injected into the contact holeV comes into contact with the first conductive layer L1.

Thereafter, as illustrated in FIG. 21, a volume of the connectingmaterial C is reduced by removing the solvent contained in theconnecting material C to form the hollow. The connecting material C thusformed comes into contact with the second conductive layer L2 and thesecond basement 20, respectively, in the first hole VA and comes intocontact with the light-shielding layer BM, the overcoat layer OC, theseal SE, and the second insulating layer 12, respectively, in the fourthhole VD, and comes into contact with the first conductive layer L1 inthe third hole VC, and comes into contact with the first basement 10 inthe concavity CC.

Next, as illustrated in FIG. 22, the protective film PF is formed. Inthe example illustrated in FIG. 22, the protective film PF is filled inthe hollow of the connecting material C and covers the second conductivelayer L2 and the connecting material C. By doing so, a surface SUB2A ofthe second substrate SUB2 is substantially planarized, and thedifference in level of the portion overlaying the contact hole V can bealleviated.

Subsequently, as illustrated in FIG. 23, the first polarizer PL1 adheresto the first basement 10 and the second polarizer PL2 adheres to theprotective film PF. It should be noted that although the adhesive layersAD1 and AD2 are interposed between the first polarizer PL1 and the firstbasement 10 and between the second polarizer PL2 and the protective filmPF, the illustration thereof is omitted here.

In the example illustrated in FIG. 23, the second polarizer PL2 alsoextends to the portion overlaying the contact hole V. Since thedifference in level caused by the contact hole V is alleviated by theprotective film PF, it is possible to suppress the second polarizer PL2from being peeled due to a difference in level of a base portion of thesecond polarizer PL2 at the time of the adhesion of the second polarizerPL2.

According to the display device DSP described above, the detectionelectrode Rx provided on the second substrate SUB2 is connected to thepad P provided on the first substrate SUB1 by the connecting material Cprovided in the contact hole V. For this reason, there is no need tomount the wiring substrate for connecting the detection electrode Rx andthe detection circuit RC on the second substrate SUB2. In other words,the wiring substrate SUB3 mounted on the first substrate SUB1 forms atransmission path for transmitting a signal necessary for displaying animage on the display panel PNL, and at the same time, forms atransmission path for transmitting a signal between the detectionelectrode Rx and the detection circuit RC.

Therefore, the number of wiring substrates can be reduced and the costcan be reduced, as compared with the configuration example requiring aseparate wiring substrate in addition to the wiring substrate SUB3. Inaddition, since a space for connecting the wiring substrate to thesecond substrate SUB2 is unnecessary, a width of a non-display area ofthe display panel PNL, in particular, a width of a side edge on whichthe wiring substrate SUB3 is mounted can be reduced. This makes itpossible to narrow the frame and reduce the cost.

In addition, since the connecting material C comes into contact with notonly the inner surface LS2 of the second conductive layer L2 in thefirst hole VA but also the upper surface LT2 of the second conductivelayer L2, the contact area between the connecting material C and thesecond conductive layer L2 may be expanded, and the poor connectionbetween the connecting material C and the second conductive layer L2 canbe suppressed.

In addition, since the connecting material C comes into contact with notonly the inner surface LS1 of the first conductive layer L1 in the thirdhole VC but also the upper surface LT1 of the first conductive layer L1,the contact area between the connecting material C and the firstconductive layer L1 may be expanded, and the poor connection between theconnecting material C and the first conductive layer L1 can besuppressed.

In addition, the hollow of the connecting material C is filled with theprotective film PF, such that it is possible to alleviate the differencein level in the third direction Z due to the formation of the hollow inthe connecting material C. In addition, since the protective film PFcovers the connecting material C and the second conductive layer L2, theprotective film PF can protect the connecting material C and the secondconductive layer L2.

In the present embodiment, the gases remaining in the contact hole V canbe released to the outside via the second hole VB. If the gases remainin the contact hole V, bubbles or the like are generated in theconnecting material C, which is a cause of poor filling. According tothe present embodiment, it is possible to prevent the poor filling ofthe connecting material C and improve the connection reliability of thedisplay device DSP.

In addition, the connecting material C has a protruding portion CA whichprotrudes from the contact hole V and is located at the upper end of thesecond hole VB. Since the connecting material C is filled up to themiddle of the second hole VB releasing gases and the gases inside thecontact hole V are expelled sufficiently, it is possible to reliablybring the connecting material C and the first conductive layer L1 intocontact with each other.

According to the manufacturing method according to the presentembodiment, it is possible to fill the connecting material C under thebarometric pressure. If there is no second hole VB, the display deviceDSP is put into a vacuum chamber and it is conceivable to fill theconnecting material C under the vacuum atmosphere in which the gasesremaining in the contact hole V are removed in advance. In the process,since it takes time to decompress the vacuum chamber and convey and putthe display device DSP into the vacuum chamber, a cycle time becomeslong. In contrast, in the manufacturing method according to the presentembodiment, since the connecting material C can be filled under thebarometric pressure, it is possible to shorten the cycle time byomitting the processes involved for the decompression and conveyance.

In addition, if the display device DSP is put under the vacuumatmosphere, volatile components slightly contained in the variousorganic insulating layers OI may expand to generate bubbles.Alternatively, the solvent contained in the connecting material C mayoften generate bubbles in the connecting material C. As a result, thereis a risk that a load may be applied to the first and second basements10 and 20 that are formed to be very thin. If the connecting material Cis filled under the barometric pressure, the generation of bubbles canbe suppressed to prevent cracks or the like from being generated in thefirst and second basements 10 and 20.

It should be noted that even when the vacuum chamber is used for thefilling of the connecting material C, the inside of the contact hole Vcan be more reliably degassed if there is the second hole VB. Accordingto the present embodiment having the second hole VB and themanufacturing method thereof, it is possible to further improve theconnection reliability by preventing the poor filling of the connectingmaterial C.

Subsequently, the display device DSP of the second embodiment will bedescribed with reference to FIG. 24. It should be noted that componentshaving functions similar to those of the display device DSP of the firstembodiment are denoted by the same reference numerals, and thedescription thereof will be omitted. In the display device DSP of thesecond embodiment, a third hole VC and a concavity CC are not includedin a contact hole V. For this reason, the second embodiment differs fromthe first embodiment in that a second hole VB is not formed at thebottom surface of the concavity CC but is formed to penetrate through afirst conductive layer L1 and a first basement 10. Other components arethe same as those of the first embodiment. As illustrated in FIG. 24,even if the second hole VB is provided in a layer other than theconcavity CC, it is possible to form a flow path for releasing the gasfrom the inside of the contact hole V as in the first embodiment.

According to the second embodiment, even combinations of materials whichcannot form the concavity CC in the first basement 10 form the secondhole VB to fill the contact hole V with the connecting material C. Forexample, the melting point of the material forming the first conductivelayer L1 may be a higher temperature than that of the material formingthe second conductive layer L2 or the first and second basements 10 and20.

As described above, according to the present embodiment, it is possibleto provide an electronic apparatus capable of narrowing the frame andreducing costs, and a method for manufacturing the same.

An example of the display device obtained from the structure disclosedin this specification will be appended.

(1) An electronic apparatus, comprising:

a first substrate including a first basement and a first conductivelayer;

a second substrate including a second basement and a second conductivelayer; and

a connecting material electrically connecting the first conductive layerand the second conductive layer,

wherein the first basement includes a first surface and a second surfaceopposite to the first surface,

the first conductive layer is located over the first surface,

the second basement includes a third surface, a fourth surface oppositeto the third surface, and a first hole penetrating the second basement,

the third surface is opposed to the first conductive layer and spacedapart from the first conductive layer,

the second conductive layer is located on the fourth surface,

the first hole includes a first opening formed on the fourth surface anda second opening formed on the third surface,

the connecting material contacts the first conductive layer and thesecond conductive layer via the first hole,

the first basement further includes a second hole that penetrates thefirst basement and connects to the first hole, and

the second hole includes a third opening that is smaller than the firstopening and is opposed to the second opening and a fourth opening thatis formed on the second surface.

(2) The electronic apparatus according to (1), wherein a diameter of thefourth opening is larger than that of the third opening.

(3) The electronic apparatus according to (1), wherein a diameter of thesecond opening is smaller than that of the first opening,

a diameter of the fourth opening is smaller than that of the thirdopening, and

a gradient formed by a central axis of the second hole and an innersurface of the second hole is smaller than that formed by a central axisof the first hole and an inner surface of the first hole.

(4) The electronic apparatus according to (1) to (3), wherein the firstbasement includes a concavity connecting to the second hole, and

the third opening is opened to a bottom of the concavity.

(5) The electronic apparatus according to (4), wherein the firstconductive layer includes the first hole and a third hole opposed to theconcavity, and

the second hole connects to the first hole via the third hole and theconcavity.

(6) The electronic apparatus according to (1) to (5), wherein a diameterof the third opening is ⅕ or less of that of the first opening.

(7) The electronic apparatus according to (1) to (6), wherein a diameterof the third opening is 5 μm or more and 30 μm or less.

(8) The electronic apparatus according to (1) to (7), wherein a centralaxis of the second hole is inclined with respect to a directionperpendicular to the first surface.

(9) The electronic apparatus according to (1) to (8), wherein the secondhole has a bent portion.

(10) The electronic apparatus according to (1) to (9), wherein theconnecting material is filled in a part of the second hole.

(11) The electronic apparatus according to (1) to (10), furthercomprising:

a seal configured to bond the first substrate to the second substrate,

wherein the seal includes a fourth hole through which the first hole andthe second hole connects to each other.

(12) A method for manufacturing an electronic apparatus, comprising:

preparing a first substrate including a first basement and a firstconductive layer and a second substrate including a second basement anda second conductive layer, the second basement being opposed to thefirst conductive layer and spaced apart from the first conductive layer;

forming a first hole penetrating the second basement,

forming a second hole penetrating the first basement, and

forming a connecting material electrically connecting the firstconductive layer and the second conductive layer in the first hole byfilling the first hole with a conductive material.

(13) The method according to (12), further comprising:

forming the first hole and a third hole penetrating the first conductivelayer opposed to the first hole by irradiating first laser light to thesecond substrate.

For example, in the method for manufacturing a display device describedabove, although the first hole VA is formed and then the second hole VBis formed, the second hole VB can be formed in advance and the firsthole VA may be formed later. In order to form the second hole VB, thelaser light LSR2 is irradiated from the second substrate SUB2 side, thatis, from above the second substrate SUB2, but the laser light LSR2 maybe irradiated from the first substrate SUB1 side, that is, from underthe first substrate SUB1 to form the second hole VB. In this case, asillustrated in FIG. 8, it is possible to form the second hole VB havinga diameter increased from the first surface 10A toward the secondsurface 10B.

What is claimed is:
 1. An electronic apparatus, comprising: a firstsubstrate including a first basement and a first conductive layer; asecond substrate including a second basement and a second conductivelayer; and a connecting material electrically connecting the firstconductive layer and the second conductive layer, wherein the firstbasement includes a first surface and a second surface opposite to thefirst surface, the first conductive layer is located over the firstsurface, the second basement includes a third surface, a fourth surfaceopposite to the third surface, and a first hole penetrating the secondbasement, the third surface is opposed to the first conductive layer andspaced apart from the first conductive layer, the second conductivelayer is located on the fourth surface, the first hole includes a firstopening formed on the fourth surface and a second opening formed on thethird surface, the connecting material contacts the first conductivelayer and the second conductive layer via the first hole, the firstbasement further includes a second hole that penetrates the firstbasement and connects to the first hole, and the second hole includes athird opening that is smaller than the first opening and is opposed tothe second opening and a fourth opening that is formed on the secondsurface.
 2. The electronic apparatus according to claim 1, wherein adiameter of the fourth opening is larger than that of the third opening.3. The electronic apparatus according to claim 1, wherein a diameter ofthe second opening is smaller than that of the first opening, a diameterof the fourth opening is smaller than that of the third opening, and agradient formed by a central axis of the second hole and an innersurface of the second hole is smaller than that formed by a central axisof the first hole and an inner surface of the first hole.
 4. Theelectronic apparatus according to claim 1, wherein the first basementincludes a concavity connecting to the second hole, and the thirdopening is opened to a bottom of the concavity.
 5. The electronicapparatus according to claim 4, wherein the first conductive layerincludes the first hole and a third hole opposed to the concavity, andthe second hole connects to the first hole via the third hole and theconcavity.
 6. The electronic apparatus according to claim 1, wherein adiameter of the third opening is ⅕ or less of that of the first opening.7. The electronic apparatus according to claim 1, wherein a diameter ofthe third opening is 5 μm or more and 30 μm or less.
 8. The electronicapparatus according to claim 1, wherein a central axis of the secondhole is inclined with respect to a direction perpendicular to the firstsurface.
 9. The electronic apparatus according to claim 1, wherein thesecond hole has a bent portion.
 10. The electronic apparatus accordingto claim 1, wherein the connecting material is filled in a part of thesecond hole.
 11. The electronic apparatus according to claim 1, furthercomprising: a seal configured to bond the first substrate to the secondsubstrate, wherein the seal includes a fourth hole through which thefirst hole and the second hole communicate with each other.
 12. A methodfor manufacturing an electronic apparatus, comprising: preparing a firstsubstrate including a first basement and a first conductive layer and asecond substrate including a second basement and a second conductivelayer, the second basement being opposed to the first conductive layerand spaced apart from the first conductive layer; forming a first holepenetrating the second basement, forming a second hole penetrating thefirst basement, and forming a connecting material electricallyconnecting between the first conductive layer and the second conductivelayer in the first hole by filling the first hole with a conductivematerial.
 13. The method according to claim 12, further comprising:forming the first hole and a third hole penetrating the first conductivelayer opposed to the first hole by irradiating first laser light to thesecond substrate.